GA3220 Datasheet, PDF (1/2 Pages) Gennum Corporation – Programmable Signal Processing Platform for Hearing Instruments

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GA3220
Programmable Signal Processing Platform for Hearing Instruments
OVERVIEW
GA3220 is a system-in-a-package (SiP)
signal processing platform specifically
designed for hearing instruments which
require high precision processing and ultra
low power consumption. The platform
GA3220
delivers high-performance audio
processing with superior power efficiency
enabling the implementation of advanced
hearing instrument algorithms such as next generation adaptive noise
reduction and environmental classification algorithms.
The GA3220 platform is comprised of three chips as illustrated in Figure1.
The GC5002 DSP chip contains both programmable instruction set DSP
cores and high performance hard-
wired co-processors. It provides
extensive computational capability
without compromising battery life.
The unique architecture of the
GC5002 simultaneously offers the
flexibility of a programmable
platform and the performance of
hard-wired design. The chip utilizes
a distributed and re-configurable
Figure 1
architecture which enables
hardware scalability and ensures
minimum power consumption while implementing advanced signal
processing algorithms.
The second chip, GC5055, is a programmable high fidelity audio Codec
designed specifically for digital hearing instrument applications. This chip
provides industry-standard interfaces for transducers, switches, volume
controls and programmer boxes. It also provides serial communication
ports for interfacing with third-party DSP chips and serial EEPROMs.
The GA3220 platform employs ThinSTAX™ advanced packaging
technology which makes it incredibly compact and suitable for CIC
instruments.
BENEFITS
• The most versatile SiP platform - fits into
any shell size from CIC to BTE
• Single programmable platform enables
product implementation for different
market segments
• Reduced product development and
manufacturing costs for OEMs through
product consolidation
• Improved time-to-market and fast
response to changing market needs
• Re-configurable and distributed
processing architecture allows easy
product enhancements and provides full
computational power scalability
• Flexible architecture enables easy
integration of a third party IP-block
(e.g., proprietary feedback cancellation
or directional processing to the system)
• Hearing instrument-centric instruction
set based DSP allows OEMs to
implement any proprietary algorithms
and provide extensive processing power
to support any leading-edge algorithm
• 0.13u silicon technology facilitates high-
end product implementation without
sacrificing good battery life
• State of the art analog chip design and
high precision digital processing
ensures the highest sound quality
• Fully integrated development
environment (GUIDE) provides fast and
easy development
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