GBJ25J Datasheet, PDF (1/3 Pages) GeneSiC Semiconductor, Inc. – Single in-line DIP package, compact size

Single Phase Glass Passivated
Silicon Bridge Rectifier
GBJ25J thru GBJ25M
V_RRM = 600 V - 1000 V
I_O = 25 A
Features
• Epoxy Resin material compliant with 94V-0 standards
of UL Material Flammability Provisions
• Compliant with RoHS Provisions
• Single in-line DIP package, compact size
• Low forward voltage, high forward current
• High surge current capability
• Types from 600 V to 1000 V V_RRM
• Small size, high heat-conducting performance
• Thermal welding performance: 260 ^oC/10 s
• Weight: 7.25 g (0.25 Oz)
• Not ESD Sensitive
GBJ Package
Maximum ratings at T_A = 25 °C (ambient temperature), unless otherwise specified
Parameter
Symbol
Conditions
GBJ25J
GBJ25K
Repetitive peak reverse voltage
DC blocking voltage
Operating temperature
Storage temperature
V_RRM
V_DC
T_j
T_stg
600
600
-50 to 150
-50 to 150
800
800
-50 to 150
-50 to 150
GBJ25M
Unit
1000
V
1000
-50 to 150
°C
-50 to 150
°C
Electrical characteristics at T_A = 25 °C, unless otherwise specified
Resistive load, single phase, half sine wave, 60 Hz.
For capacitive load derate current by 20%.
Parameter
Symbol
Conditions
GBJ25J
GBJ25K
GBJ25M
Unit
Maximum average forward
rectified current
Maximum forward surge current
Maximum forward voltage
Max. reverse current leakage at
rated DC blocking voltage
Insulation strengthg (Lead wire
to case)
Fusing feature
Thermal resistance
Mounting torgue
I_O
I_FSM
V_F
I_R
V_dis
I²t
R_ΘJA
R_ΘJC
TOR
T_C = 98 °C
T_A = 25 °C
8.3 ms pulse width,
single pulse sine-wave,
rated load, T_j = 25 °C
I_F = 12.5 A
T_A = 25 °C
T_A = 125 °C
AC Voltage: 1 minute,
current leakage < 1 mA
1ms ≤ t < 10ms, T_j=25 °C
without heatsink
with stated size heatsink
25 ⁽¹⁾
4.5 ⁽²⁾
25 ⁽¹⁾
4.5 ⁽²⁾
25 ⁽¹⁾
4.5 ⁽²⁾
350
350
350
1.05
5
500
2.5
300
22 ⁽²⁾
1.0 ⁽¹⁾
1.05
5
500
2.5
300
22 ⁽²⁾
1.0 ⁽¹⁾
1.0 ( 0.8 Nm is recomended )
1.05
5
500
2.5
300
22 ⁽²⁾
1.0 ⁽¹⁾
A
A
V
μA
kV
A²s
o_C/W
Nm
Remarks: (1) Install on PCB with stated size heat sink. In order to reach excellent heat dissipation performance, please coat thermal
conductive sillica gel in moderation, use M3 screw to screw up. Recommended heatsink size: 12.4*15.2*12.8 cm.
(2) Install on PCB without heatsink.
Apr 2016
Latest version of this datasheet at: www.genesicsemi.com/silicon-products/bridge-rectifiers/
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