SM15T Datasheet, PDF (2/3 Pages) General Semiconductor – TRANSZORB™ SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

ELECTRICAL CHARACTERISTICS RATINGS at (TA=25ºC unless otherwise noted)
Type⁽¹⁾
Device
Marking Code
Uni
Bi
Standoff Leakage Breakdown Voltage
Voltage _Current⁽³⁾
VRM _{IRM @ VRM}
VBR @ IT⁽²⁾
(Volts)
(Volts)
(µA)
Min
Max
Test
Current
IT
(mA)
Clamping Voltage Clamping Voltage
VC @ IPP
VC @ IPP
10/1000µs
8/20µs
(Volts) (Amps) (Volts) (Amps)
α_T
Max
10^-4/°C
SM15T6V8A GDE7
GDE7
5.80
1000
6.45
7.14
10
10.5
143
13.4
746
5.7
SM15T7V5A GDK7
BDK7
6.40
500
7.13
7.88
10
11.3
132
14.5
690
6.1
SM15T10A GDT7
BDT7
8.55
10.0
9.50
10.5
1.0
14.5
103
18.6
538
7.3
SM15T12A GDX7
BDX7
10.2
5.00
11.4
12.6
1.0
16.7
90.0
21.7
461
7.8
SM15T15A GEG7
GEG7
12.8
5.00
14.3
15.8
1.0
21.2
71.0
27.2
368
8.4
SM15T18A GEM7
BEM7
15.3
5.00
17.1
18.9
1.0
25.2
59.5
32.5
308
8.8
SM15T22A GET7
BET7
18.8
5.00
20.9
23.1
1.0
30.6
49.0
39.3
254
9.2
SM15T24A GEV7
GEV7
20.5
5.00
22.8
25.2
1.0
33.2
45.0
42.8
234
9.4
SM15T27A GEX7
BEX7
23.1
5.00
25.7
28.4
1.0
37.5
40.0
48.3
207
9.6
SM15T30A GFE7
BFE7
25.6
5.00
28.5
31.5
1.0
41.5
36.0
53.5
187
9.7
SM15T33A GFG7
GFG7
28.2
5.00
31.4
34.7
1.0
45.7
33.0
59.0
169
9.8
SM15T36A GFK7
BFK7
30.8
5.00
34.2
37.8
1.0
49.9
30.0
64.3
156
9.9
SM15T39A GFM7
BFM7
33.3
5.00
37.1
41.0
1.0
53.9
28.0
69.7
143
10.0
SM15T68A GGG7
GGG7
58.1
5.00
64.6
71.4
1.0
92.0
16.3
121
83
10.4
SM15T100A GGV7
GGV7
85.5
5.00
95.0
105
1.0
137
11.0
178
56
10.6
SM15T150A GHK7
GHK7
128
5.00
143
158
1.0
207
7.20
265
38
10.8
SM15T200A GHR7
GHR7
171
5.00
190
210
1.0
274
5.50
353
28
10.8
SM15T220A GHR8
GHR8
188
5.00
209
231
1.0
328
4.60
388
26
10.8
NOTES:
(1) For bi-directional devices add “C” for ±10% and “CA” for ±5% tolerance of VBR
(2) VBR measured after IT applied for 300µs square wave pulse
(3) For bipolar devices with VR=10 Volts or under, the IT limit is doubled
APPLICATION NOTES
A 1500W (SMC) device is normally selected when the threat of transients is from lightning induced transients, conducted via external leads or I/O lines. It is also used to
protect against switching transients induced by large coils or industrial motors. Source impedance at component level in a system is usually high enough to limit the current
within the peak pulse current (IPP) rating of this series. In an overstress condition, the failure mode is a short circuit.
RECOMMENDED PAD SIZES
The pad dimensions should be 0.010” (0.25mm) longer than the contact size, in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for
soldering methods
0.190 (4.83)
0.125 (3.17)
0.070 (1.78)