GFP60N03 Datasheet, PDF (1/5 Pages) General Semiconductor – N-Channel Enhancement-Mode MOSFET

GFP60N03
N-Channel Enhancement-Mode MOSFET
VDS 30V RDS(ON) 11mΩ ID 60A
TG^REENNC_F^HET®_{New Product} ^D
TO-220AB
0.415 (10.54)
Max.
0.154 (3.91)
0.142 (3.60)^Dia.
0.113 (2.87)
*
0.102 (2.56)
0.155 (3.93)
D
0.134 (3.40)
0.410 (10.41)
0.350 (8.89)
PIN
G DS
0.635 (16.13)
0.580 (14.73)
0.360 (9.14)
0.330 (8.38)
1.148 (29.16)
1.118 (28.40)
0.160 (4.06)
0.09 (2.28)
0.560 (14.22)
0.530 (13.46)
0.185 (4.70)
0.170 (4.31)
0.055 (1.39)
0.045 (1.14)
0.603 (15.32)
0.573 (14.55)
0.104 (2.64)
0.094 (2.39)
G
S
Features
• Advanced Trench Process Technology
• High Density Cell Design for Ultra Low
On-Resistance
• Specially Designed for Low Voltage DC/DC
Converters
• Fast Switching for High Efficiency
Mechanical Data
0.037 (0.94)
0.026 (0.66)
0.205 (5.20)
0.190 (4.83)
0.105 (2.67)
0.095 (2.41)
* May be notched or flat
0.022 (0.56)
0.014 (0.36)
Dimensions in inches
and (millimeters)
Case: JEDEC TO-220AB molded plastic body
Terminals: Leads solderable per MIL-STD-750,
Method 2026
High temperature soldering guaranteed:
250°C/10 seconds at terminals
Mounting Torque: 10 in-lbs maximum
Weight: 2.0g
Maximum Ratings and Thermal Characteristics (TC = 25°C unless otherwise noted)
Parameter
Symbol
Limit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current⁽¹⁾
VDS
30
VGS
± 20
ID
60
Pulsed Drain Current
IDM
100
Maximum Power Dissipation
TC = 25°C
TC = 100°C
PD
62.5
25
Operating Junction and Storage Temperature Range
TJ, Tstg
–55 to 150
Lead Temperature (1/8” from case for 5 sec.)
TL
275
Junction-to-Case Thermal Resistance
RθJC
2.0
Junction-to-Ambient Thermal Resistance
RθJA
62.5
Notes: (1) Maximum DC current limited by the package
Unit
V
A
W
°C
°C
°C/W
°C/W
5/1/01