FTR-K3WG Datasheet, PDF (5/6 Pages) Fujitsu Component Limited. – POWER RELAY 1 POLE - 25A - 1.5mm contact gap

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RoHS Compliance and Lead Free Information
1. General Information
l All signal and power relays produced by Fujitsu Components are compliant with RoHS directive 2002/95EC
including amendments.
l Cadmium as used in electrical contacts is exempted from the RoHS directives on October 21st, 2005.
(Amendment to Directive 2002/95/EC)
l All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info for older date codes
at: http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf
l Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.
This material has been verified to be compatible with PbSn assembly process.
2. Recommended Lead Free Solder Profile
l Recommended solder Sn-3.0Ag-0.5Cu.
Flow Solder condition:
Pre-heating: maximum 120˚C
Soldering:
dip within 5 sec. at
260˚C solder bath
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration:
maximum 3 sec.
We highly recommend that you confirm your actual solder conditions
3. Moisture Sensitivity
lMoisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
4. Tin Whiskers
lDipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length
whisker was found by our in house test.