MB86C69RBC Datasheet, PDF (4/4 Pages) Fujitsu Component Limited. – The Fujitsu 26-port 10Gbps Ethernet Switch Chip

MB86C69RBC
Description
Fujitsu’s new Multi-rate 10GbE, high-density switch chip
embeds 26 high-bandwidth, full-duplex 10Gbps ports into a
single, integrated, small-footprint package. Each port has
the flexibility to support KR, XAUI, CX-4 or SGMII. The
use of adaptive equalization on each port can increase reach
for XAUI, CX-4 and 10Gbps serial applications as well as
eliminate the need for external re-timer circuits, reducing
board space, power consumption and cost.
With 10Gbps serial capabilities on each port, the Fujitsu
MB86C69RBC can directly connect to optical XFP modules
or 10Gbps serial-KR backplanes (802.3ap compliant) on any
port, eliminating the use of third-party SerDes chips. This
reduces board complexity, lowers costs, and cuts down
development time.
The chip offers 520Gbps of non-blocking aggregate
switching capacity in both cut-through and store-and-forward
modes of operation. A switching latency of 300ns (including
SerDes in cut-through mode) makes the switch ideally suited
for high-density, latency-sensitive applications.
Because it was fabricated in 90nm technology, the chip
provides a typical power consumption of 22W under full
load conditions, the lowest power consumption, highest
density 10Gbps Ethernet switch chip in the industry. This
makes the MB86C69RBC well-suited for environmentally
conscious, low-power, green applications.
Eight priority classifications per port allow priority
switching based on DiffServ, MAC address, VLANs,
Extended VLANs and ports. Carrier-grade Ethernet
features include priority PAUSE, backward-congestion
notification and early drop capabilities for congestion
avoidance. These features, in combination with the largest
buffer memory in the industry, allow the MB86C69RBC to
handle both best-effort and guaranteed-high-availability
customer traffic in a single chip.
In addition to the standard 4K VLAN and QinQ capabilities,
the switch chip provides 64-user VLAN addresses that can be
used to logically partition a network without the use of
QinQ. VLAN translation capabilities allow users to translate
VLANs from external customers to VLANs from internal
providers.
The switch chip provides two 10/100/1000 Ethernet
management interfaces. An agnostic interface allows the chip
to communicate with any third-party processor. Two I²C
interfaces and two MDIO interfaces permit low-speed
communication with third-party external devices.
Both the switch and an integrated on-chip micro-engine can
be initialized using an external EEPROM, simplifying the
initialization sequence and allowing the user to customize the
switch initialization. The on-chip micro-engine executes
commands sent by the Ethernet management interface.
This simplifies software development, increases flexibility and
reduces time to market. The capability to initialize the switch
through EEPROM also allows designers to bring up the
switch along with the rest of the hardware without any
software development in place.
The Fujitsu MB86C69RBC module is the industry’s most
advanced, high-density switching architecture, providing a
low-latency, low-power, feature-rich switch in a small form
factor. The switch chip is well-suited for the L2+ switch box
and the next-generation backplane fabric applications such as
are seen in AdvancedTCA, µTCA and blade server platforms.
FUJITSU MICROELECTRONICS AMERICA, INC.
Corporate Headquarters
1250 E. Arques Avenue, M/S 333, Sunnyvale, CA 94085-5401
Tel: [phone] Fax: [phone]
E-mail: [e-mail] Web Site: http://us.fujitsu.com/micro
© 2008 Fujitsu Microelectronics America, Inc.
All company and product names are trademarks or
registered trademarks of their respective owners.
Printed in the U.S.A. 10GE-FS-21297-3/2008