CS200 Datasheet, PDF (2/2 Pages) Fujitsu Component Limited. – 65nm CMOS Technology

65nm CMOS Technology, CS200 / CS200A
Technology Lineup
CS200A: Wide Speed Range + Low Power Consumption
Low Power
Lineup
CS200A
Server/
HS-Tr
Network
STD-Tr
UHS-Tr
HV-Tr
HS-Tr
Mobile
Computing
STD-Tr
Digital Consumer
High End Server
High
Performance
Lineup CS200
LL-Tr
Cellular Phone
UHS:Ultra high speed, HS:High speed
STD:Standard, LL:Low leakage
Speed
Fast
Standard
Core
I/O
SRAM
Vdd
UHS
HS
STD
LL
HVt
1.8V
2.5V
3.3V
3.3V LVt
6T Symmetry
Technology families
CS200A
CS200
1.2V
1.0V
x
x
x
x
x
x
x
x
x
x
x
x
x
0.535µm2
0.595µm2
Fujitsu provides two series of technology: CS200 for
high-end use such as high-performance server CPU
chips, and CS200A for low-power or mobile use.
The CS200A technology, in particular, provides a
great variety of transistors from low-leakage (LL)
for cellular phones to ultra-high-speed (UHS) for
servers or network devices. Customer can mix the
transistors in a chip to meet their needs.
The 65nm family consists of the low-power
CS200A and the high-performance CS200, giving
customers the flexibility to choose the appropriate
technology to differentiate their products. The HVt
(high Vth transistor) of the CS200 achieves higher
performance. The I/O ranges from 1.8V to 3.3V. For
the CS200A, 1.8 (2.5 or 3.3V) I/O-transistors can be
embedded in a chip. The SRAM memory cell size is
less than 0.6µm2.
SPICE simulations for some benchmarking circuits
show that the new product is 20 to 30% faster than
the previous version. The great performance
improvement is a result of Fujitsu's advanced tech-
nology, which was developed for the company's
high-performance servers. The chip size of the
CS200 is only 60% the size of CS100, when making
the same spec LSI, which is 4M gate logic and 2M
gate macro. (SRAM: 0.5Mbit, PLL, etc.)
CS200 Circuit Delay Performance (ps per gate)
CS200
CS100
Inverter
5.7
7.0
2-input NAND
8.7
11.4
2-input NAND + 200-grid interconnect load
23.1
30.8
Delay reduction
77%
69%
67%
IP Portfolio
Fujitsu's foundry services offer an extensive IP
lineup, including CPU cores, image cores,
encryption, interface controllers and high-speed I/O,
all prepared for 65nm ASIC.
Fujitsu provides a one-stop, turnkey packaging
service, which includes package design, simulation,
assembly and testing. Packaging options include
standard BGA and Flip-Chip BGA (FC-BGA).
Fujitsu is the acknowledged global leader in
advanced packaging technology, innovation, patents
and manufacturing techniques.
FUJITSU MICROELECTRONICS AMERICA, INC.
Corporate Headquarters
1250 E. Arques Ave. Sunnyvale, CA 94088-3470
Tel: [phone] Fax: [phone]
E-mail: [e-mail] Web Site: http://us.fujitsu.com/micro
©2005 Fujitsu Microelectronics America, Inc.
All company and product names are trademarks or
registered trademarks of their respective owners.
Printed in the U.S.A. WFS-FS-21139-9/2005