MB90F342CESPQC-GSE2 Datasheet, PDF (16/22 Pages) Fujitsu Component Limited. – Introduction of New Packing Specifications（Notification）

8-2. Wafer base Shipment Current Specifications
C₁urrent specifications 1
Wafer Case
Aluminum Bag
Inner Box
<300mm>
<200mm>
・Reuse wafer vender’s case
label on wafer case
None
Outer Box
Shipment Note
・Mie・・・ same as label on wafer case
・directly attached on Wafer case and
AL laminate bag
・only care mark is printed
Socionext Confidential & Copyright 2015
13
・Aizu・・・Original
出荷日；
SEQ
1
*****
2015/2/23
XXX様向け 出荷明細票 *****
会津富士通ｾﾐｺﾝﾀﾞｸﾀｰｳｪｰﾊｿﾘｭｰｼｮﾝ(株)
生産部
型　格
LOT No.
出荷枚数 ケース数 備 考
SFCU02737
5L0F3S9-76882-01
12
1
1/1ç®±
PCN1505-X01A 150512
計 ====〉
12
1