MBF110 Datasheet, PDF (1/24 Pages) Fujitsu Component Limited. – Solid-State Fingerprint Sensor

MBF110
Solid-State Fingerprint Sensor
Overview
Packages
The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct
contact, fingerprint acquisition device. It is a high performance,
low power, low cost, capacitive sensor with an integrated two-
dimensional array of metal electrodes in the sensing array. Each
metal electrode acts as one plate of a capacitor and the contacting
finger acts as the second plate. A passivation layer on the device
surface forms the dielectric between these two plates. Ridges and
valleys on the finger yield varying capacitor values across the array,
which is read to form an image of the fingerprint.
The MBF110 is manufactured in standard CMOS technology and
is available in an 80-pin, VSPA 80/1 and LQFP 80/1. The 300 ×
300 sensor array has a 50 µm pitch and yields a 500-dpi image.The
80-pin SOP (VSPA)
80-pin TSOP (LQFP)
y _{A block diagram of the MBF110 is shown in Figure 1.The}
r _{MBF110 has an integrated 8-bit flash analog-to-digital converter}
a _{to digitize the output of the sensor array.The fingerprint image is}
transmitted on an 8-bit bi-directional bus interface compatible
in^{with most microprocessors.}
sensor surface is protected by a patented, ultra-hard, abrasion and
chemical resistant coating.
For SETCUR resistor differences between the MBF110 see the Pin
m^{Information table.}
li _Features
re ^{• Non-optical solid-state device}
P ^{• 300 × 300 sensor array, 50 µm pitch}
Applications
• Database and network access
• Portable fingerprint acquisition
• 1.5 cm × 1.5 cm sensor area
• Access control (home, auto, office, etc.)
• 500-dpi resolution
• ATM
• Operation from 3V to 5.5V
• Smart cards
• Ultra-hard protective coating
• Cellular phone security access
• Integrated 8-bit flash analog-to-digital converter
• 8-bit microprocessor interface
• Standard CMOS technology
• Low power, less than 200 mW