FPT-64P-M09 Datasheet, PDF (1/1 Pages) Fujitsu Component Limited. – LOW PROFILE QUAD FLAT PACKAGE 64 PIN PLASTIC

FUJITSU SEMICONDUCTOR
DATA SHEET
LOW PROFILE QUAD FLAT PACKAGE
64 PIN PLASTIC
FPT-64P-M09
64-pin plastic LQFP
(FPT-64P-M09)
Lead pitch
Package width ×
package length
Lead shape
Sealing method
Mounting height
Code
(Reference)
0.65 mm
12 × 12 mm
Gullwing
Plastic mold
1.70 mm MAX
P-LQFP64-12×12-0.65
64-pin plastic LQFP
(FPT-64P-M09)
14.00±0.20(.551±.008)SQ
* 12.00±0.10(.472±.004)SQ
48
33
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
0.145±0.055
(.0057±.0022)
49
32
0.10(.004)
INDEX
64
1
0.65(.026)
17
16
"A"
0.32±0.05
(.013±.002)
0.13(.005) M
Details of "A" part
1.50
+0.20
–0.10
.059
+.008
–.004
(Mounting height)
0.25(.010)
0~8˚
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.10±0.10
(.004±.004)
(Stand off)
C _{2003 FUJITSU LIMITED F64018S-c-3-5}
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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