FPT-28P-M17 Datasheet, PDF (1/1 Pages) Fujitsu Component Limited. – SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC

FUJITSU SEMICONDUCTOR
DATA SHEET
SMALL OUTLINE L-LEADED PACKAGE
28 PIN PLASTIC
FPT-28P-M17
28-pin plastic SOP
(FPT-28P-M17)
Lead pitch
Package width ×
package length
Lead shape
1.27 mm
8.6 × 17.75 mm
Gullwing
Sealing method
Plastic mold
Mounting height
2.80 mm MAX
Weight
Code
(Reference)
0.82 g
P-SOP28-8.6×17.75-1.27
28-pin plastic SOP
(FPT-28P-M17)
*¹ 17.75
+0.25
–0.20
.699
+.010
–.008
28
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.17
+0.03
–0.04
.007
+.001
–.002
15
INDEX
1
1.27(.050)
11.80±0.30
(.465±.012)
*² 8.60±0.20
(.339±.008)
0.47±0.08
(.019±.003)
14
0.13(.005) M
Details of "A" part
2.65±0.15
(.104±.006)
(Mounting
height)
0.25(.010)
"A"
0~8˚
0.80±0.20
(.031±.008)
0.88±0.15
(.035±.006)
0.20±0.15
(.008±.006)
(Stand off)
0.10(.004)
C _{2002 FUJITSU LIMITED F28048S-c-3-4}
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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