FPT-20P-M04 Datasheet, PDF (1/1 Pages) Fujitsu Component Limited. – THIN SHRINK SMALL OUTLINE PACKAGE

FUJITSU SEMICONDUCTOR
DATA SHEET
FPT-20P-M04
20-pin plastic TSSOP
(FPT-20P-M04)
20-pin plastic TSSOP
(FPT-20P-M04)
*¹ _{6.50±0.10(.256±.004)}
20
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THIN SHRINK SMALL OUTLINE PACKAGE
20 PIN PLASTIC
Lead pitch
Package width ×
package length
Lead shape
0.65 mm
4.40 × 6.50 mm
Gullwing
Sealing method
Plastic mold
Mounting height
1.20 mmMAX
Weight
Code
(Reference)
0.08g
P-TSSOP20-4.4×6.5-0.65
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
0.17±0.03
(.007±.001)
INDEX
*²4.40±0.10 6.40±0.20
(.173±.004) (.252±.008)
LEAD No. 1
0.65(.026)
10
0.24±0.08
(.009±.003)
0.13(.005) M
0.10(.004)
C _{2003 FUJITSU LIMITED F20014S-c-3-6}
Details of "A" part
1.10±0.10
(.043±.004)
(Mounting
height)
"A"
0~8˚
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.05±0.05
(.002±.002)
(Stand
off)
0.25(.010)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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