FPT-208P-M06 Datasheet, PDF (1/1 Pages) Fujitsu Component Limited. – LOW PROFILE QUAD FLAT PACKAGE 208 PIN PLASTIC

FUJITSU SEMICONDUCTOR
DATA SHEET
LOW PROFILE QUAD FLAT PACKAGE
208 PIN PLASTIC
FPT-208P-M06
208-pin plastic LQFP
(FPT-208P-M06)
Lead pitch
Package width ×
package length
Lead shape
0.50 mm
28.0 × 28.0 mm
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
Code
(Reference)
2.55g
P-LFQFP208-28×28-0.50
208-pin plastic LQFP
(FPT-208P-M06)
156
157
30.00±0.20(1.181±.008)SQ
* _{28.00±0.10(1.102±.004)SQ}
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
105
104
0.145±0.055
(.006±.002)
0.08(.003)
Details of "A" part
1.50
+0.20
–0.10
.059
+.008
–.004
(Mounting height)
INDEX
208
LEAD No. 1
0.50(.020)
53
0.22±0.05
(.009±.002)
52
0.08(.003) M
0˚~8˚
"A"
0.60±0.15
(.024±.006)
0.10±0.05
(.004±.002)
(Stand off)
0.25(.010)
C _{2003 FUJITSU LIMITED F208027S-c-3-3}
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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