BGA-320P-M06 Datasheet, PDF (1/1 Pages) Fujitsu Component Limited. – PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC

FUJITSU SEMICONDUCTOR
DATA SHEET
PLASTIC BALL GRID ARRAY PACKAGE
320 PIN PLASTIC
BGA-320P-M06
320-pin plastic PBGA
(BGA-320P-M06)
320-pin plastic PBGA
(BGA-320P-M06)
Lead pitch
Package width ×
package length
Lead shape
Sealing method
Mounting height
Weight
1.27 mm
27.00 mm × 27.00 mm
Ball
Plastic mold
2.46 mm Max
2.90 g
B
A
27.00(1.063)
24.00±0.10(.945±.004)
1.44
(.057)
24.13(.950)
0.635
(.025)
1.27
(.050)
27.00
(1.063)
24.00±0.10
(.945±.004)
0.20(.008) (4X)
INDEX
1.27
(.050)
24.13
(.950)
0.635
(.025)
1.44
(.057)
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
YW V U T R P NM L K J H G F E D C B A
C
0.15(.006) C
C _{2006 FUJITSU LIMITED BGA320006S-c-2-1}
ø0.75±0.15(.030±.006)
ø0.30(.012) M C A B
ø0.15(.006) M C
1.66±0.10
(.065±.004)
2.46(.097)
MAX.
0.35(.014)
MIN.
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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