2MBI200U4H-170 Datasheet, PDF (8/13 Pages) Fuji Electric – IGBT MODULE

Reliability Test Results
Test
cate-
gorie
s
Test items
1 Terminal Strength
(Pull test)
2 Mounting Strength
3 Vibration
4 Shock
1 High Temperature Storage
Reference
norms
EIAJ ED-4701
(Aug.-2001 edition)
Number
of test
sample
Number
of
failure
sample
Test Method 401
5
0
MethodⅠ
Test Method 402
5
0
methodⅡ
Test Method 403 5
0
Condition code B
Test Method 404
5
0
Condition code B
Test Method 201
5
0
2 Low Temperature Storage
Test Method 202
5
0
3 Temperature Humidity
Storage
4 Unsaturated
Pressurized Vapor
5 Temperature Cycle
Test Method 103
5
*
Test code C
Test Method 103
5
0
Test code E
Test Method 105
5
0
6 Thermal Shock
Test Method 307
5
0
method Ⅰ
Condition code A
1 High temperature Reverse Bias ^{Test Method 101} 5
*
2 High temperature Bias
( for gate )
3 Temperature Humidity Bias
4 Intermitted Operating Life
(Power cycling)
( for IGBT )
Test Method 101
5
0
Test Method 102
5
*
Condition code C
Test Method 106
5
0
* under confirmation
MS5F6136
8
13
H04-004-03a