1MBI300U4-120 Datasheet, PDF (5/13 Pages) Fuji Electric – IGBT MODULE

5. Thermal resistance characteristics
It em s
Sym b o l s
Conditions
Characteristics
min.
typ.
m ax .
Thermal resistance(1device) Rth(j-c)
IGBT
FWD
-
-
0.081
-
-
0.14
Contact Thermal resistance
(1 device) (*6)
Rth(c-f)
with Thermal Compound
-
0.0125
-
(*6) This is the value which is defined mounting on the additional cooling fin with thermal compound.
Units
o_C/W
6. Indication on module
Logo of production
Lot.No.
1M BI 300U4-120
300A 1200V
Place of manufacturing (code)
7. Applicable category
This specification is applied to IGBT-Module named 1MBI300U4-120.
8. Storage and transportation notes
• The module should be stored at a standard temperature of 5 to 35^oC and humidity of 45 to 75% .
• Store modules in a place with few temperature changes in order to avoid condensation on the
module surface.
• Avoid exposure to corrosive gases and dust.
• Avoid excessive external force on the module.
• Store modules with unprocessed terminals.
• Do not drop or otherwise shock the modules when transporting.
9. Definitions of switching time
L
RG
V GE
V CE
Ic
0V
VGE
VCE
V cc
0V ^Ic
0A
10. Packing and Labeling
Display on the packing box
- Logo of production
- Type name
- Lot No
- Products quantity in a packing box
90%
tr r
9 0%
Ir r
Ic
10%
10%
VCE
tr ( i )
tr
to n
to f f
0V
9 0%
10%
tf
MS5F6163
5
13
H04-004-03a