FA7764 Datasheet, PDF (16/18 Pages) Fuji Electric – FUJI Power Supply Control IC

FA7764
(6) Mounting SOP-8 (E-Pad)
Mounting the SOP-8 (E-Pad) package of this IC is
by providing a 4-layer board on which to mount
components for reducing the thermal resistance of
the package, along with a GND pattern in the
intermediate layer of the board, and connect the
package E-Pad by using several thermal via.
Fig. 8 shows a recommended foot pattern.
3×1.27=3.81
0.76
(1.2)
(φ0.3)
Thermal via
1.27
3.10
Note 2.
Notes:
1. The exposed pad pattern conforms to JEDEC
JESD51-5.
2. The resist is the same as that of the exposed
pad. Thermal via should also be placed in
positions outside of the resist opening area.
(7) Recommendation of continuous mode
operation
There is a possibility of jumping up the output voltage
in a discontinuous mode.
In order to prevent from this jumping up voltage, the
continuous mode operation is recommended.
Fuji Electric Systems Co., Ltd.
AN-059E Rev.1.0
16
June.2010
http://www.fujielectric.co.jp/fdt/scd/