FT122 Datasheet, PDF (43/47 Pages) Future Technology Devices International Ltd. – FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL BUS IC Datasheet Version 1.1

Document No.: FT_000647
FT122 ENHANCED USB DEVICE CONTROLLER WITH PARALLEL
BUS IC Datasheet Version 1.1
Clearance No.: FTDI# 313
The recommended values for the solder reflow profile are detailed in Table 9-1. Values are shown for
both a completely Pb free solder process (i.e. the FT122 is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT122 is used with non-Pb free solder).
Profile Feature
Pb Free Solder
Process
Non-Pb Free Solder Process
Average Ramp Up Rate (T_s to T_p)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (T_s Min.)
- Temperature Max (T_s Max.)
- Time (t_s Min to t_s Max)
150°C
200°C
60 to 120 seconds
Time Maintained Above Critical
Temperature T_L:
- Temperature (T_L)
- Time (t_L)
Peak Temperature (T_p)
Time within 5°C of actual Peak
Temperature (t_p)
Ramp Down Rate
217°C
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second Max.
Time for T= 25°C to Peak Temperature,
T_p
8 minutes Max.
Table 9-1 Reflow Profile Parameter Values
100°C
150°C
60 to 120 seconds
183°C
60 to 150 seconds
240°C
20 to 40 seconds
6°C / second Max.
6 minutes Max.
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