FT900 Datasheet, PDF (36/58 Pages) Future Technology Devices International Ltd. – The FT900 series includes the FT900,FT901, FT902 and FT903 which are complete System-On-Chip 32-bit RISC microcontrollers for embedded applications featuring a high level of integration and low powerconsumption

FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.0
Document No.: FT_000965 Clearance No.: FTDI#421
5 Devices Characteristics and Ratings
5.1 Absolute Maximum Ratings
The absolute maximum ratings for the FT900 series devices are as follows. These are in
accordance with the Absolute Maximum Rating System (IEC 60134). Exceeding these may
cause permanent damage to the device.
Parameter
Value
Unit
Storage Temperature
Floor Life (Out of Bag) At Factory Ambient
(30°C / 60% Relative Humidity)
Ambient Temperature (Power Applied)
VCC3V3 Supply Voltage
DC Input Voltage – Host H_DP and H_DM
DC Input Voltage – Peripheral D_DP and
D_DM
DC Input Voltage – Ethernet TXON, TXOP,
RXIN and RXIP
DC Input Voltage – 5V tolerance I/O cells
Others (ADC, DAC) – 3V I/O cells
-65°C to 150°C
168 Hours
(IPC/JEDEC J-STD-033A MSL Level 3
Compliant)*
-40°C to 85°C
-0.5 to +4.6
-0.5 to +5
-0.5 to +5
-0.5 to +5.6
-0.5 to +5.8
-0.5 to VCC3V3+0.5
Degrees C
Hours
Degrees C
V
V
V
V
V
V
Table 5-1 Absolute Maximum Ratings
* If devices are stored out of the packaging beyond this time limit the devices should be baked before
use. The devices should be ramped up to a temperature of +125°C and baked for up to 17 hours.
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