DS_UMFT311EV Datasheet, PDF(1/16 Page) Future Technology Devices International Ltd. – The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.

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DS_UMFT311EV Datasheet, PDF (1/16 Pages) Future Technology Devices International Ltd. – The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.

DS_UMFT311EV

USB ANDROID HOST MODULE Datasheet

Version 1.0

Document No.: FT_000689 Clearance No.: FTDI# 303

Future Technology Devices

International Ltd.

DS_FT311D_Development_Module:

UMFT311EV

(USB Android Host Module)

The FT311D Development Module is a

development module which utilises the

FT311D IC to develop USB accessories

connecting to Android platforms via

Android Open Accessory mode. It is a Full

Speed USB host specifically targeted at

providing access to peripheral hardware

from an Android platform with a USB

device port. The FT311D IC will bridge the

USB port to any one of the six user

selectable interface types like GPIO, UART,

PWM, I2C Master, SPI Master, SPI Slave

and has the following advanced features:

ï· Based on single chip USB Android Host FT311D IC.

ï· Suitable for use on any Android platform

supporting Android Open Accessory Mode

ï· Entire USB protocol handled on the chip.

(Typically 3.1 onwards, however some

platforms may port Open Accessory Mode

ï· Any one of the six user selectable interface types:-

to version 2.3.4)

GPIO, UART, PWM, I2C Master, SPI Master, SPI Slave

Interface options selectable via 3 mode select pins.

ï· 12MHz external crystal.

ï· 7 GPIO lines interface option

ï· Standard USB Host connector to connect

with Android USB Slave device.

ï· USB error indicator pin

ï· +5V Single Supply Operation.

ï· Basic UART interface with RXD, TXD, RTS, CTS,

TX_ACTIVE pins option.

ï· USB 2.0 Full Speed compatible.

ï· 4 PWM channels option.

ï· Extended operating temperature range; -

40 to +85â°C.

ï· I2C Master interface option.

ï· Board dimensions: 68.58mm x 55.38mm

ï· SPI Slave interface option supporting modes 0, 1, 2

x 14.00mm (L x W x H).

and 3 with MSB/LSB options

ï· Reduce development time.

ï· SPI Master interface option supporting modes 0, 1, 2

and 3 with MSB/LSB options.

ï· Rapid integration into existing systems.

Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced

in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are

supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology

Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your

statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in

which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary

information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by

the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41

1HH United Kingdom. Scotland Registered Company Number: SC136640

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