56F8014_08 Datasheet, PDF (93/124 Pages) Freescale Semiconductor, Inc – 16-bit Digital Signal Controllers

General Characteristics
1. Pin Group 3 can tolerate 6V for less than 5 seconds when they are configured as ADC inputs or during reset. Pin Group 3 can
tolerate 6V if they are configured as GPIO.
2. Continuous input current per pin is -2 mA
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC analog inputs
10.1.1 ElectroStatic Discharge (ESD) Model
Table 10-2 56F8014 ESD Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
2000
—
—
V
ESD for Machine Model (MM)
200
—
—
V
ESD for Charge Device Model (CDM)
750
—
—
V
Table 10-3 LQFP Package Thermal Characteristics⁶
Characteristic
Comments
Symbol
Value
(LQFP)
Unit
Junction to ambient
Natural convection
Junction to ambient
Natural convection
Junction to ambient
(@200 ft/min)
Junction to ambient
(@200 ft/min)
Junction to board
Junction to case
Junction to package top
Single layer board
(1s)
Four layer board
(2s2p)
Single layer board
(1s)
Four layer board
(2s2p)
Natural Convection
R_θJA
R_θJMA
R_θJMA
R_θJMA
R_θJB
R_θJC
Ψ_JT
74
°C/W
50
°C/W
67
°C/W
46
°C/W
23
°C/W
20
°C/W
4
°C/W
Notes
1,2
1,3
1,3
1,3
4
5
6
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESC51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
56F8014 Technical Data, Rev. 11
Freescale Semiconductor
93