MMA6271QT Datasheet, PDF (7/11 Pages) Freescale Semiconductor, Inc – ±2.5g - 10g Two Axis Low-g Micromachined Accelerometer

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
With the correct footprint, the packages will self-align when
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
The flag underneath the package is internally connected to
ground. It is not recommended for the flag to be soldered
down.
6.0
0.55
4.25
12
9
1.00
1
Pin 1 ID (non metallic)
4 _Flag
Solder areas
Non-Solder areas
Sensors
Freescale Semiconductor
MMA6271QT
7