33812 Datasheet, PDF (6/25 Pages) Freescale Semiconductor, Inc – SMALL ENGINE CONTROL IC

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
VPWR Supply Voltage⁽¹⁾
V_PWR
-0.3 to 45
Logic Input Voltage (MTX, INJIN, IGNIN, WDRFSH, LAMPIN, RIN)
V_IL
-0.3 to V_CC
Injector and RELAY Low Side Driver Drain Voltage (V_INJOUT)
V_INJOUT
V_RELOUT
-0.3 to V_{CLAMP_INJ}
-0.3 to V_{CLAMP_REL}
Lamp Low Side Driver Drain Voltage (LAMPOUT)
LAMP_OUT
-0.3 to V_{CLAMP_LAMP}
Output Clamp Energy (INJOUT and ROUT) (Single Pulse)
T_JUNCTION = 150°C, I_OUT = 1.5 A
E_{CLAMP_INJ_SP}
E_{CLAMP_REL_SP}
100
Output Clamp Energy (INJOUT and ROUT) (Continuous operation)
E_{CLAMP_INJ_CP}
100
T_JUNCTION = 125°C, I_OUT = 1.0 A, (Max. frequency is 70 Hz, Maximum Duty Cycle 90%) E_{CLAMP_REL_CP}
Output Continuous Current (INJOUT and ROUT)
T_JUNCTION = 150°C
I_{OCC_MAX}
2.0
Output Clamp Energy (LAMPOUT) (Single Pulse) - T_JUNCTION = 150°C, I_OUT = 0.5 A
ESD Voltage⁽²⁾
Human Body Model
Machine Model
Charge Device Model (Corner pins)
Charge Device Model
E_{CLAMP_LAMP_SP}
V_ESD1
V_ESD2
V_ESD3
V_ESD4
35
±2000
±200
±750
±500
THERMAL RATINGS
Unit
V_DC
V_DC
V_DC
V_DC
mJ
mJ
A
mJ
V
Operating Temperature
Ambient
Junction
Case
Storage Temperature
Power Dissipation (T_A = 25°C)⁽⁵⁾
Peak Package Reflow Temperature During Solder Mounting^{(3), (4)}
Thermal Resistance
Junction-to-Ambient
Junction- to-Lead
Junction-to-Flag
T_A
T_J
T_C
T_STG
P_D
T_SOLDER
R_θJA
R_θJL
R_θJC
-40 to 125
-40 to 150
-40 to 125
-55 to 150
1.7
Note 4
75
8.0
1.2
°C
°C
W
°C
°C/W
Notes
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. ESD testing is performed in accordance with the Human Body Model (HBM) (C_ZAP = 100 pF, R_ZAP = 1500 Ω), the Machine Model (MM)
(C_ZAP = 200 pF, R_ZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (C_ZAP = 4.0 pF).
3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
5. This parameter is guaranteed by design but is not production tested.
33812
6
Analog Integrated Circuit Device Data
Freescale Semiconductor