56F826 Datasheet, PDF (50/56 Pages) Freescale Semiconductor, Inc – 16-bit Digital Signal Controllers

S
0.15(0.006) S AC T-U S Z S
-T-
-Z-
9
-AB-
-U-
A
0.15(0.006) S AB T-U S Z S
AE
AD
-AC-
96X G
(24X PER SIDE)
SEATING
PLANE
AE
0.100(0.004) AC
M°
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -AB- IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED
AT DATUM PLANE -AB-.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -AC-.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT
DATUM PLANE -AB-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014). DAMBAR CAN NOT BE LOCATED
ON THE LOWER RADIUS OR THE FOOT.
MINIMUM SPACE BETWEEN PROTRUSION
AND AN ADJACENT LEAD IS 0.070 (0.003).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
MILLIMETERS
DIM MIN MAX
A 13.950 14.050
B 13.950 14.050
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M
12_° REF
N 0.090 0.160
Q 1_° 5_°
R 0.150 0.250
S 15.950 16.050
V 15.950 16.050
W 0.200 REF
X 1.000 REF
INCHES
MIN MAX
0.549 0.553
0.549 0.553
0.055 0.063
0.007 0.011
0.053 0.057
0.007 0.009
0.020 BSC
0.002 0.006
0.004 0.008
0.020 0.028
12_° REF
0.004 0.006
1_° 5_°
0.006 0.010
0.628 0.632
0.628 0.632
0.008 REF
0.039 REF
CE
0.25 (0.010)
GAUGE PLANE
H
W
Q^°
K
X
DETAIL AD
D
F
NJ
0.20(0.008) M AC T-U S Z S
SECTION AE-AE
CASE 842F-01
Figure 4-2 100-pin LQPF Mechanical Information
Please see www.freescale.com for the most current case outline.
56F826 Technical Data, Rev. 14
50
Freescale Semiconductor