MPX4115A Datasheet, PDF (5/9 Pages) Freescale Semiconductor, Inc – Integrated Silicon Pressure Sensor for Manifold Absolute Pressure,Altimeter or Baromater Applications

Freescale Semiconductor_M, _PI_Xn₄c₁._{15A MPXA4115A SERIES}
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
fottprint, the packages will self–align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
0.660
16.76
0.100 TYP 8X
2.54
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm SCALE 2:1
Figure 5. SOP Footprint (Case 482)
Motorola Sensor Device Data _{For More Information On This Product,}
5
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