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33884 Datasheet, PDF (5/21 Pages) Freescale Semiconductor, Inc – Switch Monitor Interface
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Power Supply Voltage
CS, SI, SO, SCLK, RST, MASL, SYNC, INT (1)
VPWR Supply Voltage (1)
Switch Input Voltage Range
Recommended Frequency of SPI Operation
ESD Voltage (2)
Human Body Model (3) (4)
Machine Model (3) (5)
VDD
VPWR
VSI
fSPI
VESD1
VESD2
-0.3 to 7.0
-16 to 50
-14 to 40
3.0
4000
200
VDC
VDC
VDC
MHz
V
Storage Temperature
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 105
°C
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow (6), (7)
TJ
TPPRT
-40 to 150
°C
Note 7.
°C
Thermal Resistance (Junction-to-Ambient)
PθJ-A
107
°C/W
Notes
1 Exceeding these limits may cause malfunction or permanent damage to the device.
2 ESD data available upon request.
3 ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω) and ESD2 testing is performed
in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω).
4 All pins are tested individually.
5 1 kV on VPWR and VDD when connected together. See page three.
6 Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33884
5