33880 Datasheet, PDF (5/25 Pages) Freescale Semiconductor, Inc – Configurable Octal Serial Switch with Serial Peripheral Interface I/O

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VDD Supply Voltage ⁽¹⁾
V_DD
-0.3 to 7.0
V_DC
CS, DI, DO, SCLK, IN5, IN6, and EN ⁽¹⁾
–
-0.3 to 7.0
V_DC
VPWR Supply Voltage ⁽¹⁾
V_PWR
-16 to 50
V_DC
Drain 1 – 8 ⁽²⁾
5.0 mA ≤ I_OUT ≤ 0.3 A
–
V_DC
-18 to 40
Source 1 – 8 ⁽³⁾
5.0 mA ≤ I_OUT ≤ 0.3 A
–
V_DC
-28 to 40
Output Voltage Clamp Low-Side Drive ⁽⁴⁾
V_OC
40 to 55
V_DC
Output Voltage Clamp High-Side Drive ⁽⁴⁾
V_OC
-15 to -25
V_DC
Output Clamp Energy ⁽⁵⁾
E_CLAMP
50
mJ
ESD Voltage ⁽⁶⁾
Human Body Model
Machine Model
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Maximum Junction Temperature
V
V_ESD1
V_ESD2
±2000
±200
T_STG
-55 to 150
°C
T_C
-40 to 125
°C
T_J
-40 to 150
°C
–
-40 to 150
°C
Power Dissipation (T_A = 25°C) ⁽⁷⁾
28 SOIC, Case 751F-05
32 SOIC, Case 1324-02
P_D
W
1.3
1.7
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
R_θJA
94
°C/W
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
Peak Package Reflow Temperature During Reflow ⁽⁵⁾, ⁽⁶⁾
R_θJA
R_θJL
T_PPRT
70
18
Note 6
°C/W
°C
Notes
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. Configured as low-side driver with 300 mA load as current limit.
3. Configured as high-side driver with 300 mA load as current limit.
4. With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
5. Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method.
6. ESD1 testing is performed in accordance with the Human Body Model (C_ZAP = 100 pF, R_ZAP = 1500 Ω), and ESD2 testing is performed
in accordance with the Machine Model (C_ZAP = 200 pF, R_ZAP = 0 Ω).
7. Maximum power dissipation with no heatsink used.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33880
5