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SPC5604BF2MLL6 Datasheet, PDF (43/109 Pages) Freescale Semiconductor, Inc – MPC5604B/C Microcontroller
2 CL includes device and package capacitances (CPKG < 5 pF).
Package pinouts and signal descriptions
3.15.5 I/O pad current specification
The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is associated to a VDD/VSS supply pair as
described in Table 22.
Table 22. I/O supply segment
Supply segment
Package
1
2
3
4
208 MAPBGA1
Equivalent to 144 LQFP segment pad distribution
144 LQFP pin20–pin49 pin51–pin99 pin100–pin122 pin 123–pin19
100 LQFP pin16–pin35 pin37–pin69 pin70–pin83 pin 84–pin15
64 LQFP
pin8–pin26 pin28–pin55 pin56–pin7
—
1 208 MAPBGA available only as development package for Nexus2+
5
MCKO
—
—
—
6
MDOn/MSEO
—
—
—
Table 23 provides I/O consumption figures.
In order to ensure device reliability, the average current of the I/O on a single segment should remain below the IAVGSEG
maximum value.
Table 23. I/O consumption
Symbol C
Parameter
Conditions1
ISWTSLW,2 CC D Dynamic I/O current for CL = 25 pF
SLOW configuration
ISWTMED2 CC D Dynamic I/O current for CL = 25 pF
MEDIUM configuration
ISWTFST2 CC D Dynamic I/O current for CL = 25 pF
FAST configuration
IRMSSLW CC D Root mean square I/O
current for SLOW
configuration
CL = 25 pF, 2 MHz
CL = 25 pF, 4 MHz
CL = 100 pF, 2 MHz
CL = 25 pF, 2 MHz
CL = 25 pF, 4 MHz
CL = 100 pF, 2 MHz
VDD = 5.0 V ± 10%,
PAD3V5V = 0
VDD = 3.3 V ± 10%,
PAD3V5V = 1
VDD = 5.0 V ± 10%,
PAD3V5V = 0
VDD = 3.3 V ± 10%,
PAD3V5V = 1
VDD = 5.0 V ± 10%,
PAD3V5V = 0
VDD = 3.3 V ± 10%,
PAD3V5V = 1
VDD = 5.0 V ± 10%,
PAD3V5V = 0
VDD = 3.3 V ± 10%,
PAD3V5V = 1
Value
Unit
Min Typ Max
— — 20 mA
— — 16
— — 29 mA
— — 17
— — 110 mA
— — 50
— — 2.3 mA
— — 3.2
— — 6.6
— — 1.6
— — 2.3
— — 4.7
MPC5604B/C Microcontroller Data Sheet, Rev. 11
Freescale Semiconductor
43