MPXA6115A_12 Datasheet, PDF (4/17 Pages) Freescale Semiconductor, Inc – High Temperature Accuracy Integrated Silicon Pressure Sensor

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
V_S
2
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and Ground
Reference
Shift
Circuitry
4
V_OUT
3
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
A fluorosilicone gel isolates the die surface and wire bonds
Super Small Outline chip carrier (Case 1317).
from the environment, while allowing the pressure signal to
Figure 3 shows a typical application circuit (output source
be transmitted to the silicon diaphragm. The MPXxx6115A
current operation).
series pressure sensor operating characteristics, internal
Figure 4 shows the sensor output signal relative to
reliability and qualification tests are based on use of dry air as
pressure input. Typical minimum and maximum output
the pressure media. Media other than dry air may have
curves are shown for operation over 0° to 85°C temperature
adverse effects on sensor performance and long-term
range. The output will saturate outside of the rated pressure
reliability. Contact the factory for information regarding media
range.
compatibility in your application.
Fluorosilicone
Gel Die Coat
Wire Bond
Lead
Frame
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale)
+5.0 V
100 nF
V_S Pin 2
MPXxx6115A
V_out Pin 4
GND Pin 3
to ADC
47 pF
51 K
MPXA6115A
4
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Sensors
Freescale Semiconductor