33790_08 Datasheet, PDF (4/12 Pages) Freescale Semiconductor, Inc – Two-Channel Distributed System Interface (DSI) Physical Interface Device

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Continuous
Load Dump - t < 300 ms
V
V_SUP
V_{SUP (t)}
- 0.5 to 25
40
Maximum Voltage on Input / Output Pins
V_DD
- 0.3 to 5.5
V
DSIxS, DSIxF ⁽¹⁾
-0.3 to V_DD+0.3
DSIxO ⁽¹⁾
- 0.3 to V_SUP + 0.3
Storage Temperature
T_STG
- 55 to 150
°C
Operating Ambient Temperature
T_A
-40 to 85
°C
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow ⁽²⁾, ⁽³⁾
T_J
T_PPRT
- 40 to 150
°C
Note 3
°C
Continuous Current per Pin
Thermal Resistance Junction to Ambient
V_DD
DSIxR
V_SUP
R_θJA
0 to 10
- 2.5 to 5.0
500
45
mA
°C / W
Thermal Shutdown
T_SD
155 to 190
°C
ESD Voltage (All Pins) ⁽⁴⁾
Human Body Model
Machine Model
V
V_ESD1
V_ESD2
± 2000
± 200
Notes
1. R = 0 Ω.
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
4. ESD1 performed in accordance with the Human Body Model (C_ZAP=100pF, R_ZAP=1500 Ω), ESD2 performed in accordance with the
Machine Model (C_ZAP = 200 pF, R_ZAP = 0 Ω).
33790
4
Analog Integrated Circuit Device Data
Freescale Semiconductor