K60P121M100SF2 Datasheet, PDF (35/72 Pages) Freescale Semiconductor, Inc – K60 Sub-Family Data Sheet Temperature range (ambient): -40 to 105°C

where
Peripheral operating requirements and behaviors
• Writes_subsystem — minimum number of writes to each FlexRAM location for
subsystem (each subsystem can have different endurance)
• EEPROM — allocated FlexNVM for each EEPROM subsystem based on DEPART;
entered with Program Partition command
• EEESPLIT — FlexRAM split factor for subsystem; entered with the Program
Partition command
• EEESIZE — allocated FlexRAM based on DEPART; entered with Program Partition
command
• Write_efficiency —
• 0.25 for 8-bit writes to FlexRAM
• 0.50 for 16-bit or 32-bit writes to FlexRAM
• n_nvmcycd — data flash cycling endurance
Figure 9. EEPROM backup writes to FlexRAM
K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
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