33886_11 Datasheet, PDF (24/27 Pages) Freescale Semiconductor, Inc – TTL / CMOS Compatible Inputs PWM Frequencies up to 10 kHz

5.0 A H-BRIDGE
THERMAL ADDENDUM - REVISION 2.0
A
AGND 1
FS 2
IN1 3
V+ 4
V+ 5
OUT1 6
OUT1 7
DNC 8
PGND 9
PGND 10
20
DNC
19
IN2
18
D1
17
C_CP
16
V+
15
OUT2
14
OUT2
13
D2
12
PGND
11
PGND
33886 Pin Connections
20-Pin HSOP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
Figure 25. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 7. Thermal Resistance Performance
Thermal
Resistance
Area A (mm²)
°C/W
R_θJA
0.0
52
300
36
600
32
R_θJS
0.0
10
300
7.0
600
6.0
R_θJA is the thermal resistance between die junction and
ambient air.
R_θJS is the thermal resistance between die junction and the
reference location on the board surface near a center lead of the
package (see Figure 25).
33886
24
Analog Integrated Circuit Device Data
Freescale Semiconductor