MC33996 Datasheet, PDF (21/24 Pages) Motorola, Inc – 16-Output Switch with SPI Control

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
OUT0 1
OUT1 2
SOPWR 3
OUT2 4
OUT3 5
VPWR 6
GND 7
GND 8
GND 9
GND 10
SCLK 11
OUT4 12
OUT5 13
CS 14
OUT6 15
OUT7 16
32
OUT15
31
OUT14
30
PWM
29
OUT13
28
OUT12
27
RST
26
GND
25
GND
24
GND
23
GND
22
SO
21
OUT11
20
OUT10
19
SI
18
OUT9
17
OUT8
33996 Pin Connections
32-Pin SOICW EP
0.65 mm Pitch
11.0mm x 7.5mm Body
4.6 x 5.7mm exposed pad
A
Device on Thermal Test Board
Figure 15. Thermal Test Board
Table 8. Thermal Resistance Performance
Material:
Outline:
Single layer printed circuit board
FR4, 1.6mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100mm board area,
including edge connector for
thermal testing
A [mm²]
0
300
600
R_θJA [°C/W]
70
49
47
Area A:
Cu heat-spreading areas on board
surface
R_θJA is the thermal resistance between die junction and
ambient air.
Ambient Conditions: Natural convection, still air
Analog Integrated Circuit Device Data
Freescale Semiconductor
33996
21