K60P144M100SF2_11 Datasheet, PDF (21/76 Pages) Freescale Semiconductor, Inc – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

4. 15pF load
Peripheral operating requirements and behaviors
5.3 Thermal specifications
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.3.2 Thermal attributes
Board
type
Single-
layer
(1s)
Four-
layer
(2s2p)
Single-
layer
(1s)
Four-
layer
(2s2p)
—
—
—
Symbol Description
R_θJA
Thermal resistance, junction to ambient
(natural convection)
R_θJA
Thermal resistance, junction to ambient
(natural convection)
R_θJMA
Thermal resistance, junction to ambient
(200 ft./min. air speed)
R_θJMA
Thermal resistance, junction to ambient
(200 ft./min. air speed)
R_θJB
R_θJC
Ψ_JT
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter,
junction to package top outside center
(natural convection)
144
LQFP
52
44
43
38
33
11
2
144
81
80
MAPBGAMAPBGA LQFP
50
TBD
TBD
30
TBD
TBD
41
TBD
TBD
27
TBD
TBD
17
TBD
TBD
10
TBD
TBD
2
TBD
TBD
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1
1
1
1
2
3
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
1. output pins
K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Freescale Semiconductor, Inc.
Preliminary
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