HC908JB16AD Datasheet, PDF (2/12 Pages) Freescale Semiconductor, Inc – Addendum to MC68HC908JB16 Technical Data

HC908JB16AD/D
20-Pin SOIC
Freescale Semiconductor, Inc.
Order Number: MC68HC908JB16JDW
VSS 1
OSC1 2
OSC2 3
VREG 4
VDD 5
PTD0/1 6
PTE1/T1CH01 7
PTE3/D+ 8
PTE4/D– 9
PTC0/TxD 10
20 ^RST
19 ^PTA0/KBA0
18 ^PTA1/KBA1
17 ^PTA2/KBA2
16 ^PTA3/KBA3
15 ^PTA4/KBA4
14 ^PTA5/KBA5
13 ^PTA6/KBA6
12 ^PTA7/KBA7
11 ^IRQ
Pins not available on 20-pin package:
PTC1/RxD
PTE0/TCLK
PTD2
PTE2/T2CH01
PTD3
CGMXFC1
CGMXFC2
PTD4
CGMOUT1
CGMOUT2
PTD5
VREGA0
VREGA1
VSSA0
VSSA1
VDDA
Internal pads are unconnected.
PTD0/1 pin: PTD0 and PTD1 internal pads are bonded together to PTD0/1 pin,
and has 50mA sink capability when configured as an output.
Pin direction must be configured such that DDRD0 = DDRD1.
Figure 1. 20-Pin SOIC Pin Assignment
–A–
20
11
–B– 10X P
0.010 (0.25) M B M
1
10
20X D
J
0.010 (0.25) M T A S B S
F
18X G
C
–T–
SEATING
PLANE
M
K
R X 45_{_}
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 12.65 12.95 0.499 0.510
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M 0_{_} 7_{_} 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
Figure 2. 20-Pin SOIC Mechanical Dimensions (Case No. 751D)
Addendum to MC68HC908JB16 Technical Data
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