MC33903 Datasheet, PDF (14/98 Pages) Freescale Semiconductor, Inc – SBC Gen2 with CAN High Speed and LIN Interface

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ESD Capability
V
AECQ100⁽²⁾
Human Body Model - JESD22/A114 (C_ZAP = 100 pF, R_ZAP = 1500 Ω)
CANH and CANL. LIN1 and LIN2, Pins versus all GND pins
all other Pins including CANH and CANL
V_ESD1-1
V_ESD1-2
±8000
±2000
Charge Device Model - JESD22/C101 (C_ZAP = 4.0 pF)
Corner Pins (Pins 1, 16, 17, and 32)
All other Pins (Pins 2-15, 18-31)
V_ESD2-1
V_ESD2-2
±750
±500
Tested per IEC 61000-4-2 (C_ZAP = 150 pF, R_ZAP = 330 Ω)
Device unpowered, CANH and CANL pin without capacitor, versus GND
Device unpowered, LIN, LIN1 and LIN2 pin, versus GND
Device unpowered, VS1/VS2 (100 nF to GND), versus GND
V_ESD3-1
V_ESD3-2
V_ESD3-3
±15000
±15000
±15000
Tested per specific OEM EMC requirements for CAN and LIN with
additional capacitor on VSUP1/VSUP2 pins (See Typical Applications on
page 86)
CANH, CANL without bus filter
LIN, LIN1 and LIN2 with and without bus filter
I/O with external components (22 k - 10 nF)
V_ESD4-1
V_ESD4-2
V_ESD4-3
±9000
±12000
±7000
THERMAL RATINGS4
Junction temperature
Ambient temperature
Storage temperature
T_J
150
°C
T_A
-40 to 125
°C
T_ST
-55 to 165
°C
THERMAL RESISTANCE
Thermal resistance junction to ambient
Peak package reflow temperature during reflow^{(2), (4)}
R_θJA
T_PPRT
50⁽⁵⁾
Note 4
°C/W
°C
Notes
2. ESD testing is performed in accordance with the Human Body Model (HBM) (C_ZAP = 100 pF, R_ZAP = 1500 Ω), the Charge Device Model
(CDM), and Robotic (C_ZAP = 4.0 pF).
3. The voltage on non-VSUP pins should never exceed the V_SUP voltage at any time or permanent damage to the device may occur. Pin
soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
5. This parameter was measured according to Figure 10:
PCB 100mm x 100mm
Top side, 300 sq. mm
(20mmx15mm)
33903/4/5
14
Bottom side
20mm x 40mm
Bottom view
Figure 10. PCB with Top and Bottom Layer Dissipation Area (Dual Layer)
Analog Integrated Circuit Device Data
Freescale Semiconductor