SST39VF1681_11 Datasheet, PDF (1/72 Pages) Silicon Storage Technology, Inc – 16 Mbit (x8) Multi-Purpose Flash Plus Active Current: 9 mA (typical)

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX28AEC
Rev. 1, 04/2011
i.MX28 Applications
Processors Data Sheet for
Automotive Products
Silicon Version 1.2
1 Introduction
The i.MX28 family of processors offers feature
integration suited for automotive infotainment
systems and gateway products. These AEC-Q100
qualified products are designed for cost-optimized
multimedia systems. The i.MX28 enables many of
the features only available in high-end systems, and
at a price point suitable for all vehicles. The core of
the i.MX28 is Freescale’s fast, power-efficient
implementation of the ARM926EJ-S™ core, with
speeds of up to 454 MHz. Integrated power
management, USB PHY, and LCD display
controller all contribute to overall system cost
savings.
The integrated power management unit (PMU) on
the i.MX28 is composed of a triple output DC-DC
switching converter and multiple linear regulators.
These provide power sequencing for the device and
its I/O peripherals such as memories and SD cards,
as well as provide battery charging capability for
Li-Ion batteries.
The i.MX28 processor includes an additional
128-Kbyte on-chip SRAM to make the device ideal
for eliminating external RAM in applications with
small footprint RTOS.
The i.MX28 supports connections to various types
of external memories, such as mobile DDR, DDR2
and LV-DDR2, SLC and MLC NAND Flash.
i.MX28
Package Information
Plastic package
Case 5284 14 x 14 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering Information & Functional Part Differences 3
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1. Special Signal Considerations . . . . . . . . . . . . . . . 10
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX28 Device-Level Conditions . . . . . . . . . . . . . . 11
3.2. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 18
3.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19
3.4. I/O AC Timing and Parameters . . . . . . . . . . . . . . . 23
3.5. Module Timing and Electrical Parameters . . . . . . 27
4. Package Information and Contact Assignments . . . . . . . 59
4.1. 289-Ball MAPBGA—Case 14 x 14 mm,
0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.2. Ground, Power, Sense, and Reference Contact
Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.3. Signal Contact Assignments . . . . . . . . . . . . . . . . . 61
4.4. i.MX281 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 68
4.5. i.MX285 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 69
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
© Freescale Semiconductor, Inc., 2011. All rights reserved.