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MP3H6115A_09 Datasheet, PDF (1/12 Pages) Freescale Semiconductor, Inc – High Temperature Accuracy Integrated Silicon Pressure Sensor
Freescale Semiconductor
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
Freescale's MP3H6115A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-
chip integration make the Freescale pressure sensor a logical and
economical choice for the system designer.
The MP3H6115A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
Features
• Improved Accuracy at High Temperature
• Available in Super Small Outline Package
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated from -40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
Pressure
MP3H6115A
Rev 4, 10/2009
MP3H6115A
Series
15 to 115 kPa (2.2 to 16.7 psi)
0.12 to 2.8 V Output
Application Examples
• Aviation Altimeters
• Industrial Controls
• Engine Control/Manifold Absolute
Pressure (MAP)
• Weather Station and Weather
Reporting Device Barometers
ORDERING INFORMATION
Device Name
Packaging
Options
Case No.
None
# of Ports
Single Dual
Gauge
Super Small Outline Package (MP3H6115A Series)
MP3H6115A6U
Rail
1317
•
MP3H6115A6T1 Tape & Reel 1317
•
MP3H6115AC6U
Rail
1317A
•
MP3H6115AC6T1 Tape & Reel 1317A
•
Pressure Type
Differential Absolute
•
•
•
•
Device
Marking
MP3H6115A
MP3H6115A
MP3H6115A
MP3H6115A
SUPER SMALL OUTLINE PACKAGES
MP3H6115A6U/T1
CASE 1317-04
MP3H6115AC6U/T1
CASE 1317A-04
© Freescale Semiconductor, Inc., 2006-2009. All rights reserved.