MCIMX50 Datasheet, PDF (1/134 Pages) Freescale Semiconductor, Inc – i.MX50 Applications Processors for Consumer Products

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX50CEC
Rev. 2, 05/2012
MCIMX50
i.MX50 Applications
Processors for
Consumer Products
Package Information
Plastic Package
Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch
Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch
Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 7 for ordering information.
1 Introduction
The i.MX50 Applications Processors (i.MX50)
represent Freescale Semiconductor’s latest addition to a
growing family of multimedia-focused products,
offering high performance processing optimized for
lowest power consumption.
The i.MX50 is optimized for portable multimedia
applications and it features Freescale’s advanced
implementation of the ARM Cortex-A8™ core, which
operates at speed as high as 800 MHz. The i.MX50
provides a powerful display architecture, including a 2D
Graphics Processing Unit (GPU) and Pixel Processing
Pipeline (ePXP). In addition, i.MX508 includes a
complete integration of the electrophoretic display
function. The i.MX50 supports DDR2, LPDDR2, and
LPDDR1 DRAM at clock rate up to 266 MHz to enable
a range of performance and power trade-offs.
The flexibility of the i.MX50 architecture allows it to be
used in a variety of applications. As the heart of the
application chipset, the i.MX50 provides a rich set of
interfaces for connecting peripherals, such as WLAN,
Bluetooth™, GPS, and displays.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7
1.4. Part Number Feature Comparison . . . . . . . . . . . . . 7
1.5. Package Feature Comparison . . . . . . . . . . . . . . . . 8
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21
4.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 30
4.4. Output Buffer Impedance Characteristics . . . . . . 36
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 47
4.7. External Interface Module (EIM) . . . . . . . . . . . . . . 59
4.8. DRAM Timing Parameters . . . . . . . . . . . . . . . . . . 67
4.9. External Peripheral Interfaces . . . . . . . . . . . . . . . 72
5. Package Information and Contact Assignments . . . . . 100
5.1. 13 x 13 mm, 0.5 mm Pitch, 416 Pin MAPBGA Package
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
5.2. 13 x 13 mm, 0.5 mm Pitch, 416 Pin PoPBGA Package
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
5.3. 17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
5.4. Signal Assignments . . . . . . . . . . . . . . . . . . . . . . 123
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
© 2012 Freescale Semiconductor, Inc. All rights reserved.
Freescale reserves the right to change the detail specifications as may be required to permit improvements
in the design of its products.