MCIMX35 Datasheet, PDF (1/140 Pages) Freescale Semiconductor, Inc – Multimedia Applications Processor for Automotive Products

Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MCIMX35SR2AEC
Rev. 1, 12/2008
MCIMX35
MCIMX35 (i.MX35)
Multimedia
Applications
Processor for
Automotive Products
1 Introduction
The i.MX35 Auto Application Processor family is
designed for automotive infotainment and
navigation applications. They are AECQ100
Grade 3 qualified and rated for ambient operating
temperatures up to 85°C.
The i.MX35 multimedia applications processor
represents the next step in low-power,
high-performance application processors.
Based on an ARM11 microprocessor core running
at up to 532 Mhz, the device offers specific features
and optimized system cost for the target
applications.
• Audio connectivity and telematics
— Compressed Audio playback from
storage devices (CD, USB, HDD or SD
card)
— PlayFromDevice (1-wire and 2-wire
support) for portable media players
— iPod/iPhone control and playback
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Functional Description and Application Information . . . . . 5
2.1 Application Processor Domain Overview. . . . . . . . . 5
2.2 Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6
2.3 Advanced Power Management Overview . . . . . . . . 6
2.4 ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 6
2.5 Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Signal Descriptions: Special Function Related Pins . . . . 12
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1 i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 12
4.2 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3 Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 17
4.5 I/O Pad DC Electrical Characteristics . . . . . . . . . . 17
4.6 I/O Pad AC Electrical Characteristics . . . . . . . . . . 22
4.7 Module-Level AC Electrical Specifications. . . . . . . 28
5 Package Information and Pinout . . . . . . . . . . . . . . . . . . 128
5.1 MAPBGA Production Package 1568-01, 17 x 17 mm,
0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
5.2 Production Package Outline Drawing . . . . . . . . . 129
6 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . 136
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2008. All rights reserved.
Preliminary—Subject to Change Without Notice