MCIMX27VOP4A Datasheet, PDF (1/122 Pages) Freescale Semiconductor, Inc – Multimedia Applications

Freescale Semiconductor
Data Sheet, Advance Information
Document Number: MCIMX27
Rev. 1, 1/2008
This document contains information on a new
product. Specifications and information herein
are subject to change without notice.
i.MX27 and i.MX27L
i.MX27 and i.MX27L
Data Sheet
Multimedia Applications
Processor
Package Information
Plastic Package
Case 1816-01
(MAPBGA–404)
Ordering Information
See Table 1 on page 4 for ordering information.
1 Introduction
The MCIMX27/MCIMX27L (i.MX27 and i.MX27L)
Multimedia Applications Processors represent the next
step in low-power, high-performance applications
processors. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX27 and
i.MX27L processors and is referred to singularly
throughout this document as i.MX27.
The i.MX27L does not include the following features:
ATA-6 HDD Interface, Memory Stick Pro, VPU,
MPEG-4/ H.263/H.264 HW encoder/decoder, and
eMMA (PrP processing, CSC, deblock, dering).
Based on an ARM926EJ-S™ microprocessor core, the
i.MX27/i.MX27L processor provides the performance
with low-power consumption required by modern
digital devices such as the following:
• Feature-rich cellular phones
• Portable media players and mobile gaming
machines
• Personal digital assistants (PDAs) and wireless
PDAs
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Ordering Information . . . . . . . . . . . . . . . . . 4
2 Functional Description and
Application Information . . . . . . . . . . . . . . . . . 4
2.1 ARM926 Microprocessor Core Platform . . . 4
2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 5
2.3 Module Descriptions . . . . . . . . . . . . . . . . . . 9
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . 27
3.1 Power-Up Sequence . . . . . . . . . . . . . . . . 36
3.2 EMI Pins Multiplexing . . . . . . . . . . . . . . . . 37
3.3 Electrical Characteristics . . . . . . . . . . . . . 40
3.4 i.MX27/iMX27L Chip-Level Conditions . . . 41
3.5 Module-Level Electrical Specifications . . . 44
3.6 Timing Diagrams . . . . . . . . . . . . . . . . . . . 55
4 Package Information and Pinout . . . . . . . . 107
4.1 Full Package Outline Drawing . . . . . . . . 107
4.2 Pin Assignments . . . . . . . . . . . . . . . . . . . 108
5 Product Documentation . . . . . . . . . . . . . . . 121
6 Revision History . . . . . . . . . . . . . . . . . . . . . 121
This document contains information on a product under development. Freescale reserves the right to change or discontinue this
product without notice.
© Freescale Semiconductor, Inc., 2008. All rights reserved.
Preliminary—Subject to Change Without Notice