IMX53IEC Datasheet, PDF (1/173 Pages) Freescale Semiconductor, Inc – i.MX53 Applications Processors for Industrial Products

Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX53IEC
Rev. 6, 03/2013
MCIMX53xC
i.MX53 Applications
Processors for Industrial
Products
Silicon Version 2.1
Package Information
Plastic Package
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 2
1 Introduction
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Functional Part Differences and Ordering
The i.MX53 processor features ARM Cortex™-A8
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
core, which operates at clock speeds as high as
800 MHz. It provides DDR2/LVDDR2-800,
LPDDR2-800, or DDR3-800 DRAM memories.
The flexibility of the i.MX53 architecture allows for its
use in a wide variety of applications. As the heart of the
application chipset, the i.MX53 processor provides all
the interfaces for connecting peripherals, such as
WLAN, Bluetooth™, GPS, hard drive, camera sensors,
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 16
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 16
4.2. Power Supply Requirements and Restrictions . . . 23
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 26
4.4. Output Buffer Impedance Characteristics . . . . . . 32
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 36
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 43
4.7. External Peripheral Interfaces Parameters . . . . . . 65
and dual displays.
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 141
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 142
Features of the i.MX53 processor include the following:
• Applications processor—The i.MX53xD
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 142
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 143
5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 144
processors boost the capabilities of high-tier
portable applications by satisfying the ever
6. Package Information and Contact Assignments . . . . . 145
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 145
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
increasing MIPS needs of operating systems and
games. Freescale’s Dynamic Voltage and
Frequency Scaling (DVFS) provides significant
power reduction, allowing the device to run at
lower voltage and frequency with sufficient
MIPS for tasks such as audio decode.
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