IMX51A_10 Datasheet, PDF (1/172 Pages) Freescale Semiconductor, Inc – i.MX51A Automotive and Infotainment Applications Processors

Freescale Semiconductor
Data Sheet: Advance Information
Document Number: IMX51AEC
Rev. 2, 06/2010
IMX51A
i.MX51A Automotive and
Infotainment Applications
Processors
Package Information
Plastic Package
Case 2017 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 2 for ordering information.
1 Introduction
The MCIMX51A (i.MX51A) Automotive Infotainment
Processor represents Freescale Semiconductor’s latest
addition to a growing family of multimedia focused
products offering high performance processing with a
high degree of functional integration, aimed at the
growing automotive infotainment market. This device
includes two graphics processors, 720p video
processing, dual display, and many I/Os.
The i.MX51A processor features Freescale’s advanced
implementation of the ARM Cortex A8™ core, targeting
speeds up to 600 MHz with 200 MHz I/O bus clock
DDR2 and mobileDDR. This device is well-suited for
graphics rendering for HMI and navigation, high
performance speech processing with large databases,
video processing and display, audio playback and
ripping, and many other applications.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1. Special Signal Considerations . . . . . . . . . . . . . . . 11
3. IOMUX Configuration for Boot Media . . . . . . . . . . . . . . . 13
3.1. NAND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2. SD/MMC IOMUX Pin Configuration . . . . . . . . . . . 14
3.3. I²C IOMUX Pin Configuration . . . . . . . . . . . . . . . . 14
3.4. eCSPI/CSPI IOMUX Pin Configuration . . . . . . . . 15
3.5. Wireless External Interface Module (WEIM) . . . . 15
3.6. UART IOMUX Pin Configuration . . . . . . . . . . . . . 15
3.7. USB-OTG IOMUX Pin Configuration . . . . . . . . . . 15
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 16
4.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 22
4.4. Output Buffer Impedance Characteristics . . . . . . 28
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 31
4.6. Module Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
4.7. External Peripheral Interfaces . . . . . . . . . . . . . . . 68
5. Package Information and Contact Assignments . . . . . 147
5.1. 19 x 19 mm Package Information . . . . . . . . . . . . 148
5.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 166
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2009-2010. All rights reserved.
Preliminary—Subject to Change Without Notice