AN1984 Datasheet, PDF (1/18 Pages) Freescale Semiconductor, Inc – Handling Freescale Pressure Sensors

Freescale Semiconductor
Application Note
AN1984
Rev 3, 11/2006
Handling Freescale Pressure Sensors
by: William McDonald
INTRODUCTION
Smaller package outlines and higher board densities
require the need for automated placement of components.
These components are supplied in embossed carrier tape on
plastic reels to meet the increased demand and facilitate ease
of handling. This application note is intended to provide
general information and understanding for handling
Freescale’s surface mount pressure sensors. Equipment
details are not provided in this document and it is
recommended that end users contact suppliers of equipment
for specific applications.
METHODS OF HANDLING
Components can be picked from the carrier tape using
either the vacuum assist or the mechanical type pick up
heads. A vacuum assist nozzle type is most common due to
its lower cost of maintenance and ease of operation. The
recommended vacuum nozzle configuration should be
designed to make contact with the device directly on the metal
cover and avoid vacuum port location directly over the vent
hole in the metal cover of the device. To provide a more secure
hold on the device, contact with the plastic ridge around the
perimeter of the metal cover should be avoided to prevent loss
of vacuum pressure. Multiple vacuum ports within the nozzle
may be required to effectively handle the device and prevent
shifting during movement to placement position.
Figure 1 shows two styles of multiple port vacuum nozzles
for the MPXH series device as an example. Figure 2
represents the nozzle location on the device.
Vacuum pressure required to adequately support the
component should be approximately 25 in Hg (85kPa). This
level is typical of in-house vacuum supply.
Pick up nozzles are available in various sizes and
configurations to suit a variety of component geometries. To
select the nozzle best suited for the specific application, it is
recommended that the customer consult their pick and place
equipment supplier to determine the correct nozzle. In some
cases it may be necessary to fabricate a special nozzle
depending on the equipment and speed of operation.
Figure 1. MPXH Series Multiple Port
Vacuum Nozzles
Figure 2. Nozzle Location
Figure 3. SSOP Axial Style Port
AVAILABLE PACKAGES
Freescale offers several small outline surface mount device
families. These are MPXA, MPXH, MPXM, and MPXY series
of devices.
These devices are also available in axial ported versions to
allow pressure to be interfaced to a device via a hose
connection.
Pick up nozzles for these packages should be configured to
apply vacuum only to the flat surface of a port base. An access
clearance in the nozzle for a port shank is necessary to
properly handle these device configurations. See Figure 3.
© Freescale Semiconductor, Inc., 2006. All rights reserved.