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8050M Datasheet, PDF (6/6 Pages) Foshan Blue Rocket Electronics Co.,Ltd. – Silicon NPN transistor in a SOT-23 Plastic Package
8050M
Rev.E Mar.-2016
DATA SHEET
回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free)
说明:
1、预热温度 25~150℃,时间 60~90sec;
2、峰值温度 245±5℃,时间持续为 5±0.5sec;
3、焊接制程冷却速度为 2~10℃/sec.
Note:
1.Preheating:25~150℃, Time:60~90sec.
2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions
温度:260±5℃
时间:10±1 sec.
Temp.:260±5℃
Time:10±1 sec
包装规格 / Packaging SPEC.
卷盘包装 / REEL
Package Type
封装形式
SOT-23
Units/Reel
只/卷盘
3,000
Reels/Inner Box
卷盘/盒
10
Units 包装数量
Units/Inner Box Inner Boxes/Outer Box
只/盒
盒/箱
30,000
6
Units/Outer Box
只/箱
180,000
Dimension 包装尺寸 (unit:mm3)
Reel
Inner Box 盒
Outer Box ç®±
7〞×8 180×120×180 390×385×205
使用说明 / Notices
http://www.fsbrec.com
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