Z100B Datasheet, PDF (7/7 Pages) Formosa MS – Zener Diode

Zener Diode
Z100B THRU Z330B
Formosa MS
High reliability test capabilities
Item Test
1. Solder Resistance
Conditions
at 260±5^oC for 10±2sec.
immerse body into solder 1/16"±1/32"
2. Solderability
at 245±5^oC for 5 sec.
3. Pull Test
1kg in axial lead direction for 10 sec.
4. Bend Lead
5. High Temperature Reverse Bias
6. Pressure Cooker
7. Temperature Cycling
1kg weight applied to each lead bending
arc 90^o±5^o for 3 times.
V_R=80% rate at T_J=150^oC for 168 hrs.
15P_SIG at T_A=121^oC for 4 hrs.
-55^oC to +125^oC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Thermal Shock
0^oC for 5 min. rise to 100^oC for 5 min. total 10 cycles.
Reference
MIL-STD-750D
METHOD-2031
MIL-STD-202F
METHOD-208
MIL-STD-750D
METHOD-2036
MIL-STD-750D
METHOD-2036
MIL-STD-750D
METHOD-1038
JESD22-A102
MIL-STD-750D
METHOD-1051
MIL-STD-750D
METHOD-1056
9. Humidity
at T_A=85^oC, RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175^oC for 1000 hrs.
MIL-STD-750D
METHOD-1021
MIL-STD-750D
METHOD-1031
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Page 7
Document ID Issued Date
DS-222716 2008/02/10
Revised Date Revision
2010/03/10
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