MMBZ5221B Datasheet, PDF (7/8 Pages) Pan Jit International Inc. – SURFACE MOUNT SILICON ZENER DIODES

Zener Diode
Formosa MS
MMBZ5221B THRU MMBZ5270B
Reel packing
PACKAGE
REEL SIZE
SOT-23
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
3,000
4.0
30,000 183*183*123 178
CARTON
SIZE
(m/m)
382*262*387
CARTON
(pcs)
240,000
APPROX.
GROSS WEIGHT
(kg)
11.6
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5^oC~40^oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
Critical Zone
TL to TP
TL
TL
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t25^oC to Peak
3.Reflow soldering
Time
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
Tsmax to TL
-Ramp-upRate
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(TP)
Time within 5^oC of actual Peak
Temperature(tP)
Ramp-down Rate
Time 25^oC to Peak Temperature
Soldering Condition
<3^oC/sec
150^oC
200^oC
60~120sec
<3^oC/sec
217^oC
60~260sec
255^oC-0/+5^oC
10~30sec
<6^oC/sec
<6minutes
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Page 7
Document ID Issued Date
DS-221744
2009/08/10
Revised Date Revision
2010/04/12
B
Page.
8