RB520G_10 Datasheet, PDF (6/7 Pages) Formosa MS – 100mA Surface Mount Small Signal Schottky Diode- 30V

Small Signal Schottky Diode
RB520G/RB521G
Formosa MS
Reel packing
COMPONENT
PACKAGE REEL SIZE REEL SPACING BOX
(pcs)
(m/m)
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
APPROX.
CARTON GROSS WEIGHT
(pcs)
(kg)
SOD-723FL
7"
4,000
4.0
40,000 183*183*123 178 382*262*387 320,000
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5^oC~40^oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
TL
TL
Tsmax
Critical Zone
TL to TP
Ts m i n
tS
Preheat
Ramp-down
25
t25^oC to Peak
3.Reflow soldering
Time
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
Tsmax to TL
-Ramp-upRate
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(TP)
Time within 5^oC of actual Peak
Temperature(tP)
Ramp-down Rate
Time 25^oC to Peak Temperature
http://www.formosams.com/
TEL:[phone]
FAX:[phone]
Page 6
Soldering Condition
<3^oC/sec
150^oC
200^oC
60~120sec
<3^oC/sec
217^oC
60~260sec
255^oC-0/+5^oC
10~30sec
<6^oC/sec
<6minutes
Document ID Issued Date
DS-221694
2008/02/10
Revised Date Revision
2010/12/29
C
Page.
7