BAS40WS_10 Datasheet, PDF (6/7 Pages) Formosa MS – 200mA Surface Mount Small Signal Schottky Diode-40V

Small Signal Schottky Diode
BAS40WS
Formosa MS
Reel packing
PACKAGE
SOD-323F
REEL SIZE
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
3,000
4.0
30,000 183*183*123
REEL
DIA,
(m/m)
178
CARTON
SIZE
(m/m)
382*262*387
CARTON
(pcs)
240,000
APPROX.
GROSS WEIGHT
(kg)
8.0
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5^oC~40^oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
TL
TL
Tsmax
Critical Zone
TL to TP
Tsmin
tS
Preheat
Ramp-down
25
t25^oC to Peak
3.Reflow soldering
Time
Profile Feature
Average ramp-up rate(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(ts)
Tsmax to TL
-Ramp-upRate
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(TP)
Time within 5^oC of actual Peak
Temperature(tP)
Ramp-down Rate
Time 25^oC to Peak Temperature
Soldering Condition
<3^oC/sec
150^oC
200^oC
60~120sec
<3^oC/sec
217^oC
60~260sec
255^oC-0/+5^oC
10~30sec
<6^oC/sec
<6minutes
http://www.formosams.com/
TEL:[phone]
FAX:[phone]
Page 6
Document ID
DS-22161X
Issued Date
2008/02/10
Revised Date
2010/03/10
Revision
B
Page.
7