SFM31 Datasheet, PDF (1/2 Pages) Formosa MS – Super fast recovery type

Chip Silicon Rectifier
SFM31 THRU SFM36
Formosa MS
Super fast recovery type
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
Mechanical data
Case : Molded plastic, JEDEC DO-214AB
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting Position : Any
Weight : 0.00585 ounce, 0.195 gram
0.152(3.8)
0.144(3.6)
0.032(0.8) Typ.
0.040(1.0) Typ.
SMC
0.276(7.0)
0.260(6.6)
0.244(6.2)
0.228(5.8)
0.012(0.3) Typ.
0.189(4.8)
0.173(4.4)
0.087(2.2)
0.071(1.8)
0.040 (1.0) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (AT T_A=25^oC unless otherwise noted)
PARAMETER
CONDITIONS
Forward rectified current
Ambient temperature = 50^oC
Forward surge current
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
VR = VRRM TA = 25^oC
VR = VRRM TA = 100^oC
Junction to ambient
f=1MHz and applied 4vDC reverse voltage
Symbol
IO
IFSM
IR
RqJA
CJ
TSTG
MIN.
-55
TYP.
16
45
MAX.
3.0
UNIT
A
100
A
5.0
100
+150
uA
uA
o_{C / w}
pF
o_C
SYMBOLS
SFM31
SFM32
SFM33
SFM34
SFM35
SFM36
MARKING
CODE
S31
S32
S33
S34
S35
S36
V _RRM ^*1 V _RMS ^*2
(V)
(V)
50
35
100
70
150
105
200
140
300
210
400
280
V _R ^*3
(V)
50
100
150
200
300
400
V _F ^*4
(V)
T _RR ^*5
(nS)
Operating
temperature
( ^o C)
0.95
35
1.25
-55 to +150
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
*5 Reverse recovery time